Quality and Flexibility

Printed Circuit Board Assembly
including BGA located in the Dallas
Ft. Worth Metroplex

We have established a good balance of speed, precision and flexibility with our Surface Mount and Thru-Hole manufacturing processes.

All of our medium to large volume PCB assembly orders are processed with our picking place and wave solder machines. At REYcomp, PCB production and test comprises all technology combinations, including BGA and product-specific special processes. All electronic assemblies are available in lead-free (RoHS-compliant) or lead (MIL spec) technology, according to IPC-A-610 and AS910.

Device programming
JTAG, ICT, Boundary scan
AOI, X-Ray
Conformal coating
Press-fit technology
Ultrasonic welding
Functional test for assemblies and systems
BGA placement and removal

Surface Mount

Panelizaton of SMT printed circuit boards is an effective way to reduce cost.

Thru Hole

Mounting the TH components on the same side as the SMT fine pitch and BGA allows for faster service.

A PCB during Wavesolder preheating phase.

Mixed Technology

Automated processing of electronic assemblies ensures traceablity and consistent IPC-A-610 class 2 and even 3 reliability.